- List
- EU dual-use list – Annex I to Regulation (EU) 2021/821, updated annually
- Originating regime
- Quốc gia/EU
a. Stage placement accuracy less (better) than 30 nm;
b. Stage positioning measurement performed using laser interferometry;
c. Position calibration within a Field Of View (FOV) based on laser interferometer length-scale measurement;
d. Collects and stores images having more than 2 × 108 pixels;
e. FOV overlap of less than 5 percent in vertical and horizontal directions;
f. Stitching overlap of FOV less than 50 nm; and
g. Accelerating voltage more than 21 kV.
Note 1:
3B503 includes SEM equipment designed for chip design recovery.
Note 2:
3B503 does not apply to SEM equipment designed to accept a Semiconductor Equipment and Materials International (SEMI) standard wafer carrier, such as a 200 mm or larger Front Opening Unified Pod (FOUP).
b. Stage positioning measurement performed using laser interferometry;
c. Position calibration within a Field Of View (FOV) based on laser interferometer length-scale measurement;
d. Collects and stores images having more than 2 × 108 pixels;
e. FOV overlap of less than 5 percent in vertical and horizontal directions;
f. Stitching overlap of FOV less than 50 nm; and
g. Accelerating voltage more than 21 kV.
Note 1:
3B503 includes SEM equipment designed for chip design recovery.
Note 2:
3B503 does not apply to SEM equipment designed to accept a Semiconductor Equipment and Materials International (SEMI) standard wafer carrier, such as a 200 mm or larger Front Opening Unified Pod (FOUP).