Sunday, 1 November 2026
Standing Office 81 (SOVNPA 81) emblem Viet Nam NVietnam National Presiding Agency
on Countering the Proliferation of Weapons of Mass Destruction
Standing Office 81

3E002"Technology" according to the General Technology Note, other than that specified in 3E001, for the "development" or "production" of a "microprocessor microcircuit", "microcomputer microcircuit" or microcontroller microcircuit core, having an arithmetic logic unit with an access width of 32 bits or more and any of the following features or characteristics:

List
EU dual-use list – Annex I to Regulation (EU) 2021/821, updated annually
Originating regime
Thỏa ước Wassenaar
a. A 'vector processor unit' designed to perform more than two calculations on 'floating-point' vectors (one-dimensional arrays of 32-bit or larger numbers) simultaneously;
Technical Note:
For the purposes of 3E002.a., a 'vector processor unit' is a processor element with built-in instructions that perform multiple calculations on 'floating-point' vectors (one-dimensional arrays of 32-bit or larger numbers) simultaneously, having at least one vector arithmetic logic unit and vector registers of at least 32 elements each.
b. Designed to perform more than four 64-bit or larger 'floating-point' operation results per cycle; or
c. Designed to perform more than eight 16-bit 'fixed-point' multiply-accumulate results per cycle (e.g., digital manipulation of analogue information that has been previously converted into digital form, also known as digital "signal processing").
Technical Notes:
1. For the purposes of 3E002.a. and 3E002.b., 'floating-point' is defined by IEEE-754.
2. For the purposes of 3E002.c., 'fixed-point' refers to a fixed-width real number with both an integer component and a fractional component, and which does not include integer-only formats.
Note 1:
3E002 does not control "technology" for multimedia extensions.
Note 2:
3E002 does not control "technology" for micro-processor cores, having all of the following:
a. Using "technology" at or above 0,130 μm;
and
b. Incorporating multi-layer structures with five or fewer metal layers.
Note 3:
3E002 includes "technology" for the "development" or "production" of digital signal processors and digital array processors.